| 摘要 |
PURPOSE:To obtain a plated product with superior adhesive strength and solderability, by subjecting the surface of a material to bright Cu plating or bright Ni plating, forming a layer of copper or the like having a specified thickness by striking, and carrying out tinning. CONSTITUTION:A member for an electronic apparatus made of an electrically conductive material is cathodically or anodically degreased, washed in water, pickled, washed in water, and subjected to bright Cu plating or bright Ni planting as under plating. A layer of copper, tin or a tin alloy having 0.01-0.5mum thickness is then formed by striking, and tin or tin alloy plating is finally carried out. Thus, the tin or tin alloy layer formed by the plating can be prevented from being peeled off. |
