| 摘要 |
<p>PURPOSE:To separate a semiconductor substrate into individual semiconductor elements so as to avoid the generation of cracks and damages in element parts by spraying a liquid whereon pressure is applied and whose flow speed is reduced down or a liquid wherein polishing particles are mixed. CONSTITUTION:Spraying is performed on scribe lines 5 of the corresponding semiconductor substrate 4, which is accordingly separated into the individual semiconductor elements 6, by means of a device 3 which has a spray nozzle 1 and a movable stage 2 and then can spray pure water wherein polishing particles are mixed from the spray nozzle 1 by applying pressure and thus reducing down the flow speed. Thereat, this method produces less damage to cut sections and makes difficulty of the generation of cracks and cut strains because of cutting by applying weak force, unlike in scrap and dicing, on the surface to be cut for a long time.</p> |
