首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPS59434(Y2)
申请公布日期
1984.01.07
申请号
JP19790094926U
申请日期
1979.07.07
申请人
发明人
分类号
E04F13/12;E04B1/80;E04B1/84;E04B1/94;E04C2/26;(IPC1-7):E04F13/12
主分类号
E04F13/12
代理机构
代理人
主权项
地址
您可能感兴趣的专利
BRUCIATORE PERFEZIONATO, PARTICOLARMENTE ADATTO PER CALDAIE MURALI
Mechanical Pipe Joint
NAVIGATION SYSTEM FOR ADAPTIVE WEIGHTING OF GPS AND DEAD-RECKONING INFORMATION.
SENSOR DEVICES.
Cryosurgical probe
SYNCHRONIZER RING MATERIAL MADE OF CU ALLOY FOR AUTOMOBILE GEARBOX, EXCELLENT IN SEIZURE RESISTANCE
METHOD FOR HEATING METALLIC STRIP AND DEVICE THEREFOR
DEVICE FOR STRAIGHTENING BENDING OF SUB-LANCE
WATER COOLED REFRACTORY PANEL FOR REPAIRING BLAST FURNACE WALL
DIE MEMBER FOR APPARATUS FOR PRODUCING GREEN COMPACT MOLDING
APPARATUS FOR PRODUCING GREEN COMPACT MOLDING
LIQUID BLEACHING AND CLEANING AGENT COMPOSITION
STEEL SHEET EXCELLENT IN FORMABILITY AND HARDENABILITY BY HIGH ENERGY DENSITY BEAM IRRADIATION AND ITS PRODUCTION
MOLDING METHOD OF GREEN COMPACT MOLDING
PRODUCTION OF MESO-CARBON MICROBEAD
FRICTION MATERIAL COMPOSITION AND FRICTION MATERIAL USING THE SAME
INFRARED LIGHT ABSORBER
PRESSURE-SENSITIVE ADHESIVE COMPOSITION
THIXOTROPIC COMPOSITION
EPOXY RESIN COMPOSITION, JOINTING MEMBER FOR AIRTIGHT SEALING COATED THEREWITH AS ADHESIVE, PACKAGE FOR SEMICONDUCTOR DEVICE MOLDED THEREFROM, AND SEMICONDUCTOR DEVICE USING THEM
