发明名称 RESIN FORMING METHOD FOR SEMICONDUCTOR ELEMENT AND DEVICE THEREFOR
摘要 PURPOSE:To enable to cast resin containing no air bubbles into a cavity and thus improve the characteristic of the element and the disconnection of bonding wires by restraining the generation of nests in a formed product by a method wherein bubble removing process and pressure casting process are separated to each other. CONSTITUTION:Teflon-made shutters 32 are provided between a pot 3 and runners 6 so as to open and close the runners 6. The shutters 32 are put into a closed state, the tablet of pre-heated epoxy resin is thrown into the pot 3, and then the resin 7 is compressed by a plunger 31. The air bubbles in the resin are crushed down thoroughly, the air bubbles going out of the resin and the air in the pot escape to the outside of a metal mold from the air vent 41 of the plunger 31, and accordingly the resin 7 can be changed into one with air bubbles removed approximately perfectly. The pressure of the plunger 31 is released by the signal of a pressure sensor 36, and thus the shutters 32 are opened, then pressure casting is performed by changing the pressure of the plunger.
申请公布号 JPS592326(A) 申请公布日期 1984.01.07
申请号 JP19820109969 申请日期 1982.06.28
申请人 TOKYO SHIBAURA DENKI KK 发明人 NISHIKI KAZUHIRO
分类号 H01L21/56;B29C43/00;B29C45/00;B29C45/02;B29C45/14;B29C45/18;B29C45/26;B29C45/28;B29C45/58 主分类号 H01L21/56
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