| 摘要 |
<p>PURPOSE:To sheath solder uniformly onto the whole leads of a package, and to mount the package positively to a printed substrate by using a jig in which through-holes of diameters larger than the diameters of the leads are formed in response to the arrangement of the leads in the soft soldering of the leads. CONSTITUTION:The jig 10 with the through-holes 11, which are formed in response to the arrangement of the leads 5 and diameters thereof are larger than those of the leads, is disposed onto the package 1 turned upside down. Solder balls (spheres) 12 are entered into each through-hole 11 in which the leads are received. The size of the solder ball 12 corresponds to quantity of which solder is sheathed onto the whole surface of the lead. When using solder paste, a screen 14 to which holes 13 corresponding to the through-holes 11 of the jig 10 are formed is prepared, and a fixed quantity of solder paste 15 is dropped uniformly into the through-holes 11 through a known screen process printing method. Even when either of solder balls or solder paste is used, the package 1 and the jig 10 are melted in an atmospheric furnace at a temperature such as approximately 250 deg.C, and solder is sheathed onto the whole leads.</p> |
