| 摘要 |
PURPOSE:To increase the reliability of a semiconductor element at low cost by a method wherein the semiconductor is placed on the bonding agent which has been brought to a semihardened state, and a complete hardening process is performed on the above. CONSTITUTION:A bonding agent 5 is applied at the part 22 to be die-bonded on a substrate 21, the bonding agent 5 is brought to a semihardened state by drying up the substrate 21, whereon the bonding agent is applied, at a high temperature, a semiconductor element 24 is placed on the bonding agent 5, and the bonding agent 5 is completely hardened. As a result, the semiconductor element can be mounted at any time, and this enables to perform a production adjustment. Also, as the bonding agent is used at B stage, no oozing and the like can be prevented, thereby enabling to enhance the reliability of the titled semiconductor element at low cost. |
