| 摘要 |
In a method for electroplating non-metallic surfaces on a substrate (e.g., of plating hole walls in metal clad laminates), metallic sites are formed on the surface to be plated and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component (e.g. a dye, surfactant, chelating agent, brightener, levelling agent or pyrophosphate ions) which causes the plating to preferentially occur at the sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby an increased rate of plating on the site surfaces is achieved with respect to the plating reaction on a surface consisting of the metal to be plated out. The method allows non-metallic surfaces to be rapidly and uniformly electroplated, without the need to electrolessly plate the surfaces first. |
