| 摘要 |
PURPOSE:To contrive the improvement in a high-frequency gain by reducing a heat resistance of a semiconductor device by fixing a semiconductor chip to a projection of an island consisting of a metal of good heat conductivity such as copper and further connecting a grounding electrode of the semiconductor chip to said projection through a metallic thin wire. CONSTITUTION:A projection 3A is formed on an island part 3 consisting of a metal such as copper and a semiconductor chip 6 is fixed to this projection 3A through a fixing material such as AuSn. a grounding electrode on the semiconductor chip 6 is connected with the projection 3A through a metallic thin wire 5 consisting of gold etc. Furthermore, the semiconductor chip 6 is sealed hermetically by the island part 3 and the insulating container 1 through a sealing material 2. Because the semiconductor chip 6 is fixed to the projection 3A made of gold, the heat dissipation from the back side of the semiconductor chip 6 increases. Also, as the grounding electrode on the semiconductor chip is connected with the projection 3A through the metallic thin wire, the parasitic capacity and inductance become small. |
