| 摘要 |
PURPOSE:To make the thermal expansion coefficients of the longitudinal direction and lateral direction of a substrate coincide with each other, and to obtain the substrate, thermal strain of which is reduced, by conforming a crystallographic axis in the direction of cutting and a crystallographic axis in the in-plane direction to the direction of cutting. CONSTITUTION:A plurality of wafers 2, the surfaces of which have a plurality of striped conductors 1, are laminated and thermocompression-bonded, and the thermocompression bonded body 3 is cut 7 in the axial direction, thus forming a wiring substrate 8 with a plurality of electrodes 9 consisting of said conductors 1. On said cutting 7 in such a case, the crystallographic axis of the substrate 8 in the direction of cutting A and a crystallographic axis in the in-plane direction B to the direction of cutting are conformed, and the thermal expansion coefficients of the longitudinal direction and lateral direction of the substrate 8 are made coincide with each other. Said wafer 2 consists of a crystal such as an silicon crystal, and the conductor 1 is composed of a conductor such as an Al conductor.
|
