| 摘要 |
PURPOSE:To contrive an increase in the efficiency of heat dispersion by a method wherein a sheathing resin is provided with a cavity part and a heat dissipation fin in such a way that the side opposite to the direction, in which a circuit board is mounted, of the island of a metallic lead frame is partially exposed. CONSTITUTION:A circuit board 6 having conductor wirings 10 on its surface is mounted on an island 1 of a metallic lead frame using a bonding agent 5, passive and active elements 8 are mounted on this board 6 and these elements 8 are connected to each other through fine metal wires 7. Moreover, a sheathing resin 3 is provided with a cavity part 2 in such a way that the side opposite to the direction, in which the board 6 is mounted, of the island 1 of the lead frame is partially exposed and moreover, a heat dissipation fin 9 is mounted to this island 1 with a bonding agent 5'. Thereby, a heat dissipation effect can be improved.
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