| 摘要 |
PURPOSE:To obtain the LSI cooling system without which the limitation of LSI height is unnecessary and that the probe of an oscilloscope can be brought into contact with a terminal easily by a method wherein the LSI is mounted on the side reverse to a substrate, and a cooling module is brought into contact with the LSI through a hole. CONSTITUTION:A structure, wherein a cooling module 2 is contacted to an LSI 3 through the hole of a substrate 6 and the heat generated on the LSI 3 is transmitted to cooling water, is formed. The cooling water running is a pipe 1 flows in the direction as shown by the arrow A in the diagram, the bellows of a cooling module 2 passes through the hole of the substrate 6 and comes in contact with the LSI 3 and absorbs the heat of the LSI. Accordingly, the warmed-up water moves up as shown by the arrow C in the diagram, and cooling water runs as shown by the arrow B, and the heat generated on the LSI 3 is conveyed by the cooling water running in the direction of the arrow D. The LSI is soldered to the substrate 6 by a terminal 4, it begins to work by receiving a power source and a signal from the substrate 6 through the terminal 4, and the result is outputted to the substrate 6 through the terminal 4. As the LSI 3 is arranged on the opposite side of the pipe 1 for the substrate 6, and the observation of waveform with the probe of an oscilloscope contacting to the terminal 4 can be performed without generation of a hindrance. |
