发明名称 HEAT-RESISTANT RESIN FILM
摘要 PURPOSE:To provide a heat-resistant resin film having excellent resistance to heat and chemicals, mechanical characteristics, dielectric characteristics and low water absorptive power and suitable for use as an electrical insulating film, consisting of a cured article obtd. by curing a mixture of an arom. polythioether sulfone polymer and a curing agent. CONSTITUTION:This heat-resistant film is formed from a cured article obtd. by curing a mixture of an arom. polythioether sulfone polymer and a curing agent. Pref. this film is prepd. by molding a mixture of an arom. polythioether sulfone polymer and at least one curing agent selected from the group consisting of epoxy compds. having at least two epoxy groups per molecule, aminoplast resins and a metal acetylacetonate into a film and heat-treating the film. Preferred examples of the metal acetylacetonate are Cu(II), Mn(II), Fe(III), or Ni(II) acetylacetonate.
申请公布号 JPS62187764(A) 申请公布日期 1987.08.17
申请号 JP19860029046 申请日期 1986.02.14
申请人 ASAHI GLASS CO LTD 发明人 KASHIWAME KIYOTERU;KITAMURA TATEO;OZAWA SHIGEYUKI
分类号 C08J3/24;C08J5/18;C08K5/09;C08L81/00;C08L81/06;H05K1/03 主分类号 C08J3/24
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