| 摘要 |
PURPOSE:To fix the dual-in-line package type IC to a printed board while reducing the cost of equipment by using a cutter in which a vertical surface section for a form and an edge for cutting are unified when a lead of the IC is cut conformed to a through-hole formed to the printed board. CONSTITUTION:The cutter 6 cutting the leads of a DIP type IC is constituted as follows. That is, the cutter 6 is prepared by tool steel, the width of a plane view is made a rectangular parallelopiped shape approximately same as size in the longitudinal direction of an IC package 1, and the vertical surface section 7 for the form is formed to the upper section of an end surface opposite to the lead 2. The cutting edge 8 projecting in the horizontal direction only by a desired quantity from the vertical surface section 7 is formed to the lower section, and the upper-surface cutting edge surface 8' is made horizontal. An escape groove 9 for chip is formed horizontally between the vertical surface section 7 and the cutting edge 8. The cutter 6 is constituted in this manner, the leads 2 of the IC package 1 are inserted into the through-holes 4 formed to the printed board 3, and excessive leads 2 projecting downward are cut by the cutting edge 8 while being held down by the vertical surface section 7. |
