| 摘要 |
PURPOSE:To raise a temperature of region where it is directly related to the sealing and keep the other region as low as possible and thereby suppress the deterioration of semiconductor device as much as possible by providing a region where heat or light is absorbed only in the periphery of the cap of package and by making the width of such region almost equal to the width of sealing material. CONSTITUTION:31 is the central portion of sealing cap and 32 is the graphitized region in the periphery of cap 31. The surface of region 31 is applied by a heat resistant paint or roughly finished by sand blast etc. The processed cap 6 and soldering material 5 are stacked on the package 1 and it is sealed by putting it into the conveyor furnace. Since the region 32 is graphitized or finished roughly, it absorbs efficiently heat and light and thereby the soldering material 5 flows smoothly. Even when a resin adhesive material is used in place of the soldering material 5, the temperature of region 32 first rises and thereby perfect sealing effect can be obtained. Moreover, the region 32 is formed in the periphery of the cap and the width is set almost equal to the width of the brazing material, soldering material and resin sealing material. Thereby, only the temperature of the sealing area can be raised effectively and influence on internal elements and deterioration thereof can be lessened. |
