发明名称 APPLYING METHOD OF WAX ONTO WAFER
摘要 PURPOSE:To form a thin uniform wax layer on the wafer by applying DC high voltage between a spray nozzle for a solution and the wafer and atomizing wax by using compressed air. CONSTITUTION:An organic solvent solution of wax is made contain in a pressure-resisting vessel 1, and the spray nozzle 2 is set up. The wafer 8 is placed on a fixed base 3, and a DC high voltage applying device 4 and a compressed air feeder 5 are set up. A wax solution in the vessel 1 is atomized toward the wafer 8 of a lower section from the nozzle 2 by compressed air from the device 5. The pressure is regulated by a regulating valve 6. DC high voltage is applied between the nozzle 2 and the wafer 8 by the operation of the device 4 at the same time as the atomizing. Accordingly, the thin uniform wax layer can be formed onto the wafer 8.
申请公布号 JPS58223331(A) 申请公布日期 1983.12.24
申请号 JP19820107014 申请日期 1982.06.22
申请人 SHINETSU ENGINEERING KK;NAOETSU DENSHI KOGYO KK 发明人 KATAGIRI KIYOO;TAKAHASHI ISAMU;ISHIDAIRA SEIJI;SAKATA SHIYOUJI
分类号 H01L21/02;H01L21/304 主分类号 H01L21/02
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