发明名称 SOLDERING METHOD
摘要 PURPOSE:To prevent solder from flowing into a hole, by inserting a pin which has a greater external diameter than the internal diameter of a stud and is tapered at the top at a specific angle into the stud in contact with the stud from the other surface of a plate, and carrying out soldering. CONSTITUTION:The stud (a) is inserted into a holed printed plate (b) from one surface and soldered. At this time, the tapered pin (d) which has the greater external diameter than the internal diameter of the stud (a) and is tapered at the top at the specific angle is inserted from the other surface of the plate (b) in contact with the stud (a) by a spring (f) provided to a base (e). Thus, the part a-2 of the stud (a) is heated and pressurized by a heating chip to perform the soldering.
申请公布号 JPS58221668(A) 申请公布日期 1983.12.23
申请号 JP19820104555 申请日期 1982.06.17
申请人 FUJITSU KK 发明人 SANGO TOORU
分类号 H05K3/34;B23K1/00;B23K1/14;B23K3/00;H05K3/00 主分类号 H05K3/34
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