| 摘要 |
PURPOSE:To prevent any erroneous recognition of a pattern at an automatic die bonder, by overlaying a colored auxiliary film on the reverse surface of a film sheet, thereby to reduce an unnecessary reflected light at the reverse surface. CONSTITUTION:A semiconductor wafer is attached to a transparent plastic film sheet 11 and divided into chips 13. A green semitransparent auxiliary film sheet 20 is overlaid on the reverse surface of the sheet 11. This is placed on a device 12, and the chips 13 are dispersed. The sheet 11 is irradiated with a light source 14, and the refrected light is received by a pattern recognition device 15 to detect the arrangement pattern of the chips 13 from the intensity of the reflected light. The chip at the position specified by the device 15 is sucked by means of a vacuum collet 16 and transferred to a predetermined base mount. By this constitution, the reflected light intensity is remarkably reduced, so that it is made possible to prevent any erroneous recognition by the device 15, and the product yield is improved. |
