摘要 |
PURPOSE:To enable to form metal films simultaneously on a plurality of substrates by slightly displacing the substrates in a vacuum tank, laminating, arranging the substrates, and forming by a thin film method the metal film at the exposed ends of the substrates. CONSTITUTION:A glazed layer 2 is formed on a substrate 1. Substrates 1 are laminated and contained in the part except the layer 2 in a recess 8 formed on an inner cover 7 to become the substrate mounting surface of a vacuum tank 6, and the lowermost substrate 1 is supported by a supporting surface 9. Heat resistors 3 of metal films and thermally conductive layer 4 are respectively formed by a depositing method or sputtering method on the part of the exposed layer of each substrate 1, and a head unit H is formed via a resist etching step. In this manner, when each metal film is formed in the tank 6, the troublesome operation of masking the substrates 1 one by one can be eliminated, and a metal film may be formed simultaneously on a plurality of substrates. |