| 摘要 |
<p>PURPOSE:To simply and effectively cool by forming a cooling medium passage between the upper surface of an insulating substrate and the lower surface of an IC chip, and using as a heat sink lead wirings. CONSTITUTION:An interval between a ceramic substrate 2 and a printed board 5 is maintained constantly via a stopper 13, and a cooling medium passage is formed. The generated heat of a semiconductor chip is transmitted via a bump 3 to the substrate 2 and the lead wirings 4, and effectively dissipated. When a metal piece is attached to the wirings 4 and the surface area is increased, the heat exchange can be further improved.</p> |
