| 摘要 |
PURPOSE:To eliminate dew condensation even at high temperature and moisture by filling filler material in a space formed by a semiconductor laser and sealing means and bonding the filler member to the sealing means. CONSTITUTION:A sealing material 26 is filled in a space which is formed between a collimator supporting member 22, a laser unit 29 and a mounting plate 20, and the material 26 is bonded to the periphery. For example, the material 26 is bonded to the plate 20, thereby preventing water from flowing from inserting holes 31, 32 for inserting cords or the like, and considerable effect can be obtained for dew condensation. When the material 26 is bonded to at least one inner surface of the plate 20 and the member 22, thereby preventing the water from flowing via a gap 27 or the like. Accordingly, it can prevent water from reaching the emitting window glass 24, thereby preventing the dew condensation. When the material 26 and the laser unit 29 are further bonded, the dew condensation can be effectively prevented. |
