发明名称 Method of fabricating semiconductor device using an Sb protection layer
摘要 A method for fabricating a semiconductor device comprises the steps of forming the first semiconductor layer on a semiconductor substrate, forming a surface protection layer of antimony (Sb) or the material having Sb as its main component, executing the other steps necessary for the fabrication of the semiconductor device, removing the surface protection layer, and forming, on the first semiconductor layer thus exposed, the second semiconductor layer.
申请公布号 US5017517(A) 申请公布日期 1991.05.21
申请号 US19900518035 申请日期 1990.05.02
申请人 HITACHI, LTD. 发明人 MOCHIZUKI, KAZUHIRO;TANOUE, TOMONORI;KUSANO, CHUSHIROU;MASUDA, HIROSHI;MITANI, KATSUHIKO
分类号 H01L29/73;H01L21/20;H01L21/28;H01L21/331;H01L29/205;H01L29/737;H01L29/80 主分类号 H01L29/73
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