| 摘要 |
PURPOSE:To inspect the presence and positional slippage of mounted components by a method wherein a transfer pattern is compared with a fixed data, after the unevenness pattern of the substrate surface necessary for the mounting of chip components is transferred to a transfer paper. CONSTITUTION:A hybrid IC (HIC) serving as the object to be inspected is loaded on a stage 11. The HIC consists of the substrate 11 and the chip components 2. The transfer paper 12 passes between a transfer head 14 and a thin plate soft rubber 13 from a supply roll and is led to a containing roll. When a transfer head 15 descends, the position-shape pattern of the chip components is formed on the transfer paper. The formed transfer pattern is image-processed by an ITV camera, etc. |
