| 摘要 |
PURPOSE:To prevent the generation of burrs by blocking the outflow of resin at the time of a mold process by a method wherein dummy leads are placed side by side between each external lead, and then the top end of this dummy lead is arranged in proximity to a mold part. CONSTITUTION:A mounting part 13 whereon a semiconductor element is placed is arranged inside surrounded by the longitudinal frame 11 and the transverse frame 12 of a frame. In the periphery of the mounting part 13, many internal leads 14 are so arranged as to put the top ends in proximity to each other, and then joined to the transverse frame 12 by the external lead 15 which is the extension of the lead 14. The dummy leads 20 are arranged between the external leads 15 and joined to the transverse frame 12. The top end of the dummy lead 20 is set in parallel to and sufficiently in proximity to the mold part 17, but the clearance of 0.1mm. at least is provided. Further, supporting pieces 21 serving also to prevent the outflow of resin are arranged outside the external leads 15 at both ends, and joined to the longitudinal frame 11. |
