| 摘要 |
The adhesion of a passivating layer to Au conductors is improved by the provision of an interlayer formed by reacting a layer of metal with the Au and removing the excess reactive metal before depositing the passivating layer. The Au contacts and conductors 5 may be formed by sputtering and contact sites are masked by photoresist 6. The layer 7 of Al, Ti, Zr, Cr or Mo is deposited by sputtering forming a reacted layer 8 at the exposed surfaces of the Au conductors. The unreacted metal of layer 7 is removed by etching and the resist 6 removed. A layer of passivation is deposited and openings etched to expose the unreacted contact sites on the Au conductors e.g. for contact by a second layer of conductors. <IMAGE> |
