| 摘要 |
<p>The present invention is directed to a process comprising the galvanoplastic deposition of a gold-copper-cadmium alloy on a cathode in an aqueous bath containing 3 to 5 gr/l of gold in the form of alkali metal gold cyanide, 50 to 60 gr/l of copper in the form of alkali metal copper cyanide, 2 to 3 gr/l of cadmium in the form of alkali metal cadmium cyanide, a complexing agent, an organic wetting agent and an amount from 18 to 22 gr/l of an alkali metal sulfite sufficient current being provided to maintain a cathodic current density of from 2 to 3 amp/dm2 and an alloy deposition speed of greater than 0.65 micron thickness per minute, said bath being maintained at a temperature of from 70.degree. to 75.degree.C and at pH of from 9 to 11.</p> |
