| 摘要 |
<p>49,274 OF THE DISCLOSURE The present invention is directed to a semiconductor housing consisting of a cup-shaped bottom member and a hood-shaped top member, into the interior of which is poured a sealing compound, or filler, at least up to a plane of separation between the top and bottom portions. The top portion is provided with an apron or skirting which overlaps the separation within the housing, between the apron and the overlapped region of the bottom member there is a clearance which is filled with the sealing compound until below the plane of separation.</p> |
