发明名称 BONDING DEVICE
摘要 PURPOSE:To perform satisfactory bonding, by forming a crimping surface and a hole for supplying a fine metallic wire in the position apart from said surface on the forward end of a bonding tool and providing a hole having an opening part for holding the fine metallic wire on the crimping surface of the tool. CONSTITUTION:A crimping surface 11 and a hole 9 for supplying a fine metallic wire in the position apart from the surface 11 are formed on the forward end of a bonding tool 10 of a bonding device. A hole 12 having an opening part for holding the fine metallic wire is provided on the surface 11 of the tool 10 to suck the fine metallic wire in the stage of crimping the fine metallic wire. The fine metallic wire is thus positioned always in the central part of the surface 11 without deviation before bonding and after the 2nd bonding, and part of the fine metallic wire is crushed uniformly by the surface 11.
申请公布号 JPS58218386(A) 申请公布日期 1983.12.19
申请号 JP19820101844 申请日期 1982.06.14
申请人 MATSUSHITA DENKI SANGYO KK 发明人 TAKEHASHI NOBUTOSHI
分类号 B23K20/10;B23K20/00;H01L21/60;H01L21/607 主分类号 B23K20/10
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