| 摘要 |
PURPOSE:To obtain the titled molding excellent in durability, heat resistance, affinity for adhesive and printability, by exposing a polyether ether ketone resin molding to low-temperature plasma and then treating the molding with a specified low-molecular compound. CONSTITUTION:A treating chamber containing a polyether ether ketone resin molding is evacuated fully and then a gas having no plasma polymerizability (e.g., Ar) is introduced into the chamber so that the pressure in the chamber is 0.1-10 Torr. Low-temperature plasma is generated in the chamber by application of a high voltage. After disappearance of the plasma, a low-molecular compound having addition polymerizability (e.g., acrylic acid) is introduced in a gaseous state into the chamber to treat the molding. EFFECT:It is possible to impart improved affinity for adheisve, hydrophilicity, oleophilicity, etc. to a molding. USE:Printed circuit boards, heat-resistant insulating materials. |
