| 摘要 |
A chip type electronic component includes a resin frame 21, two metal foil terminals 31, 32 bonded to respective ends of the frame and an electronic component element 1, such as a tantalum solid electrolytic capacitor element, enclosed in the frame. At least one of the frame ends and associated metal foil terminal has a slit 4 for accepting lead wires 5a, 5b of the element 1, the lead wires being connected to the respective terminals. Insulating resin 22 is potted in the space remaining in the frame. Methods for making such components include fabricating a number of frames 21 connected together from a piece, e.g. a sheet, of resin and cutting the piece so as to separate the frames once the individual components have otherwise been completed. <IMAGE> |
