发明名称 PACKAGE FOR MIC
摘要 PURPOSE:To keep satisfactorily the connection impedance when a module is loaded and unloaded in a high frequency region, by drilling a hole of such a waveguide structure that a part of a hermetic sealing terminal for high frequency input/output protrudes to the waveguide part and using the protruded terminal as a coaxis-waveguide converting element. CONSTITUTION:A recess part 201 is formed at the center of a package main body 20 to package a carrier 2, and at the same time notches 202 are formed across the width direction of the notch 201. A DC bias terminal 4 and a signal transmitting terminal 5 are sealed hermetically to the wall part of the notch 202. Then a hole 203 of a waveguide structure is formed at both ends respectively in the longer side direction on the rear side of the main body 20. A high frequency input/output terminal 3 is sealed hermetically to the wall part between the hole 203 and the notch 201, and a part of the terminal 3 is protruded through the hole 203. Under such conditions, the carrier 2 is packaged into the notch 201 and then connected to hermetic sealing terminals 3, 4 and 5 respectively. Then a cover 21 is welded hermetically.
申请公布号 JPS58213502(A) 申请公布日期 1983.12.12
申请号 JP19820096663 申请日期 1982.06.04
申请人 FUJITSU KK 发明人 SAKANE TOSHIROU;HACHITSUKA HIROYUKI;SUGAWARA HIDEO
分类号 H01P1/00;H01P5/103;H01P5/107 主分类号 H01P1/00
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