| 摘要 |
<p>An assembled electronic device is prepared by electrically connecting the terminal electrodes (2) of an electronic device (1) to corresponding terminals (4) of an electronic circuit board (3) made of an elastically flexible material and each shaped in the form of a mobile flap by being partly surrounded by an incision (5) using an anisotropically conductive adhesive (6) made by dispersing conductive particles in an adhesive matrix and exhibiting electric conductivity only in the direction of the thickness of the layer. The electrical connection between the electrodes of the assembled electronic device is firm and reliable. <IMAGE></p> |
