| 摘要 |
PURPOSE:To prevent the increase of contact resistance by lifting off a polyimide resin by using a photo-resist for forming an intermediate Al layer in three-layer structure and employing the residual polyimide resin as an inter-layer insulating film. CONSTITUTION:First Al is evaporated onto a substrate 1, and a first Al layer 2 is formed through pattern etching. Second Al is evaporated to form a second Al layer 6, the layer 6 is coated with the photo-resist 7, and the photo-resist 7 is removed while leaving a through-hole section. The exposed section of the second Al layer 6 is removed while using the photo-resist 7 as a mask. The polyimide group resin 8 is sprayed against the whole surface, and solidified instantaneously. The polyimide resin 8 is removed together with the photo-resist 7. A third Al layer 9 is formed so as to be connected to the second Al layer 6 exposed. |
