| 摘要 |
PURPOSE:To enable to accurately slice an ingot of large bore and a wafer with less cutting margin by blades having small eccentricity with small bore by providing the blades formed with a cutting edge on the inner periphery of an annular disc, a rotary support for supporting two blades, and another rotary support for supporting a workpiece to be cut. CONSTITUTION:A motor 16 is driven to rotate blades 10 at a high speed in the state capable of slicing, an ingot 17 is elevationally moved to move it to a slicing position. Then, a motor 20 is driven to forward it by a feeder through a chuck 19 in a direction A while rotating the motor at a low speed. Thus, the blades 10 are contacted with a peripheral diamond cutting edges 12 of the blades 10 for slicing, thereby obtaining the wafer. Since the slicing can be performed while rotating the ingot 17, the distance H' of stroking the ingot 17 may be at least the length of the radius of the ingot 17, the bore of the blade 10 can be remarkably reduced, the tension force and supporting strength of the blades 10 can be increased, and the eccentricity can be extremely reduced. |
