| 摘要 |
PURPOSE:To house two pairs of chips one package, and to attain mounting having high density by forming a chip by two pairs of the first and second chips, backs thereof are fixed mutually, while shaping a through square-hole in which a flange section disposing pads on the surface and the back and a projecting section fastening the chip are formed to the package. CONSTITUTION:A semiconductor element is constituted in such a manner that a through square-hole 1A is shaped to a package 1, a flange section 1C and projecting sections 1B are formed on an outer circumference and a chip 2 is fixed by an adhesive layer 14. The backs of a first chip 2A and a second chip 2B are fastened mutually, and pads 4 and patterns 6, 7 are disposed on the surface and back of the flange section 1C. The first chip 2a is connected to pins 12 through the patterns 6 and conductors 13 and the second chip 2B through the patterns 7 and the conductors 13. |
