| 摘要 |
PURPOSE:To eliminate terminal chip and reduce manufacturing steps and thereby improve manufacturing yield and reliability by providing a chip stage part which allows its lead to be extended from the one edge and is located at the bottom of recess of base material and placing a chip on said chip stage. CONSTITUTION:A lead 32 is attached to the upper surface of base material 31 by an insulating sealing material 33 such as glass. The chip stage 32-2 which is extended from the one terminal 32-1 among the lead 32 and located at the bottom part of recess 35 and the lead 32 are integrated. A semiconductor chip 34 is welded on the chip stage 32-2 and its rear side is placed in ohmic-contact. Each electrode of chip 34 is connected to the lead 32 by means of a wire 36. Since the chip stage 32-2 is connected to an external lead by the lead 32, a reverse bias voltage applied from the rear side to the substrate of semiconductor chip 34 can be externally given through a terminal 32-1 of lead 32 and thereby the terminal chip which has been used in the prior art is no longer necessary. |
