发明名称 PREPARATION OF SMALL-SIZED ELECTRONIC COMPONENTS
摘要 PURPOSE:To produce a small-sized square electronic component by inserting a square-bar-shaped electrode into a glass cylinder, providing a chip between electrodes, deforming the external circumference of glass cylinder into a square bar along the electrode through heating, pressing and by melting such glass and forming it along said electrode. CONSTITUTION:An electrode 1 is inserted into a hole 11 of metal molding 12, a diode chip 13 is placed on the surface of electrode portion A of this electrode 1, a glass cylinder 3 is inserted in such a way as surrounding it and finally the electrode 2 is inserted in such a way as the electrode part A thereof holds the diode chip 13. Next, the upper part of electrode 2 is held from the upper side and is pressurized and heated. Here, the heating temperature should be a softening temperature of the glass cylinder 3 or so. An adequate pressure to be applied is 2-3kg and when the softened glass cylinder 3 is pressurized, this glass cylinder 3 melts and formed along the square part of the electrode A. The external shape is also formed into square shape in conjunction with an effect of pressure to be applied. The inside is sealed by glass cylinder 3 melted and adhered to the electrode.
申请公布号 JPS58210641(A) 申请公布日期 1983.12.07
申请号 JP19820093313 申请日期 1982.05.31
申请人 ROOMU KK 发明人 WATANABE HISATOSHI
分类号 H01L23/48;H01L21/50 主分类号 H01L23/48
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