| 摘要 |
PURPOSE:To prevent influence of external force on IC chip even when an external force such as bending force is applied on a base plate such as card by setting E1 and E2 in such a manner that either one of them is larger than EB where the vertical elastic coefficient of IC chip material is considered as EB for the base material or as E1 for the first mold material or for E2 at the second mold material. CONSTITUTION:The outside of IC chip 2 is directly surrounded by a first mold material 6, its outside is further surrounded by a second mold material 7, thus forming a mold product. When at least either one of E1 and E2 is set larger than EB, stiffness of the material layer having a vertical elastic coefficient smaller than EB becomes smaller than that of a card itself (bottom 9, boty 10). Thereby, it may be easily deformed, deformation by bending or tortional force applied on the card itself is absorbed and influence of such deformation is not transferred to an IC chip 2. As a result, breakdown, separation or missing of IC chip can be prevented. In regard to the relation between E1, E2 and EB, it is preferable that at least either one of E1 and E2 is larger than EB/10. |
