| 摘要 |
PURPOSE:To enhance sealing characteristic between resin sealing material and copper heat radiating fin thereby improving reliability and reduce manufacturing cost by loading elements on the copper heat radiating fin directly in the reducing atmosphere or through a copper plating layer. CONSTITUTION:Elements 2 are electrically connected to an inner lead 3 provided on the copper heat radiating fin 1 through a bonding lead 4. These elements 2 are integratingly sealed by the resin sealing material 6 in such a way that a part of copper heat radiating fin 1 and an outer lead 5 connected to the inner lead 3 are exposed externally. As described above, such semiconductor device 10 is formed by loading elements 2 without forming a silver plated layer or nickel plated layer on the copper heat radiating fin 1. Since the resin sealing material 6 seals directly the copper heat radiating fin 1, its close contactness is high and entrance of water into inside is tightly prevented, while protecting wirings formed to the elements 2 from corrosion. |
