发明名称 BONDING AND APPARATUS THEREOF
摘要 PURPOSE:To always realize adequate, accurate and reliable bonding and easily set the optimum conditions in accordance with kinds of lead dimensions, wire material and kinds of ball dimensions by detecting degree of the ruptures while pressing and breaking a part of wire with a pressing force, and stopping the operation when the wire is broken up to the specified degree. CONSTITUTION:In the initial condition, the capillary 1 is located just above the pad 5 to be bonded in the height h on the pellet 4. Then, the lifted frame 24 is moved downward by driving a pulse motor. At the beginning, it moves downward at a high speed, and when the lowest end of ball 3 approximates on the pad 5, it moves slowly. This changeover timing is considered as T2, downward displacement Z at this time is set to Z=Z1 measured downward. During downward movement, the stopper 33 is excited and attracts the horn 13 so that the horn 13 does not swing and the capillary 1 does not vibrate. Thereafter,the timing where the speed of down-movement is lowered and the lower end of ball 3 is in contact with the pad 5 is considered as T3. At this time, when downward displacement Z is considered to be equal to Z0, the relation, Z0=h-t0 can be obtained.
申请公布号 JPS58210629(A) 申请公布日期 1983.12.07
申请号 JP19820093032 申请日期 1982.06.02
申请人 KAIJIYOU DENKI KK 发明人 MIYOSHI HIDEAKI
分类号 H01L21/60 主分类号 H01L21/60
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