| 摘要 |
PURPOSE:To improve the reliability of the semiconductor device by forming a notch section to a resin-seal package between leads and lengthening a creeping distance between the leads. CONSTITUTION:In the resin type semiconductor device, the notch sections F are formed to the resin-seal package among the leads (21-23), and the creeping distances among the leads are lengthened. Accordingly, a leakage current path is difficult to be formed even by the presence of moisture, and reliability is improved largely. |
