发明名称 NEW BISPHENOL COMPOUND AND ITS PRODUCTION
摘要 PURPOSE: To obtain a new compound suitable as a raw material for an epoxy resin useful as a sealing material for an integrated circuit having excellent water resistance, insulating properties, low dielectric properties, etc., a laminating material, etc., a developer useful for heat-sensitive recording and a fading inhibitor, having excellent solubility in various organic solvents. CONSTITUTION: This compound is shown by formula I [a (substituted) phenylmethylene is bonded to a phenol nucleus at the p- or o-position based on the phenolic, OH; R1 and R2 are each a 1-4C alkyl; R is R1 or a 1-4C alkoxy; n is 0-2] such as 4,4'-(phenylmethylene)bis(2,3,6-trimethylphenyl). The compound of formula I is obtained by reacting a compound of formula II with a compound of formula III in the presence of an acid catalyst such as hydrochloric acid or p-toluenesulfonic acid in an alcoholic solvent such as methanol.
申请公布号 JPH08259485(A) 申请公布日期 1996.10.08
申请号 JP19950066537 申请日期 1995.03.24
申请人 HONSHU CHEM IND CO LTD 发明人 IWASAKI YOSHIAKI;MASUDA TORU
分类号 B01J27/04;B01J27/10;B01J27/16;B01J31/02;B01J31/04;C07B61/00;C07C39/16;C07C41/30;C07C41/40;C07C43/23 主分类号 B01J27/04
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