摘要 |
PURPOSE:To prevent displacement between terminals to be measured and contact by providing a partitioning member which is higher than the contact between the contacts of measuring jig. CONSTITUTION:A package of semiconductor device is put into a package container 2 while it is being guided by the positioning cut-away part 4 of package guide 3, the measuring terminals extruded to a side from the semiconductor device package are respectively placed on the corresponding contacts and thereby electrical contact required for measurement is formed between each measuring terminal and contact 5. In this case, total of eight partitioning plates 6, two each for each side of package container 2, are provided between the contacts and these are extruded upward higher than the contact 5. Therefore, the measuring terminal to be placed on the contacts 5 in both sides of partitioning plate 6 is placed on the contact 5 while it is positioned by the partitioning plate 6. Therefore, the positioning between measuring terminal and contact 5 is also carried out by each partitioning plate 6 in addition to the positioning cut-away part 4 of package guide 3. Thereby, displacement between the measuring terminal and contact 5 can certainly be prevented. |