| 摘要 |
PURPOSE:To enable to obtain the thickness of adhered layers in uniformity without damaging adhesive strength by a method wherein a semiconductor element is adhered and fixed by providing projections on a die stage. CONSTITUTION:When a lead frame 11 is blanked, the projections 13 are simultaneously formed on the mount surface for the semiconductor element of the die stage 12 at least at three points. The mounting method is as follows: first, adhered resin 14 composed of epoxy resin mixed with Ag or Au powder is coated over the die stage 12, and the semiconductor element 15 is placed thereon and slightly pressed so that the bottom thereof contacts the projections 13 of the die stage 12. Next, heat-setting treatment is performed in the range of 150 deg.C- 200 deg.C. Thus, since the adhered layer due to the adhered resin 14 is determined by the height dimension of the projections 13 approximately, uniform adhered layers can be always obtained, and therefore dispersion decreases and is improved, as compared with conventional ones. |
