发明名称 UN DISPOSITIVO DE RECEPTACULO DE CONTACTO FORMADO DE CHAPA METALICA PARA MONTAR UN SUBSTRATO SOBRE UN PANEL DE CIRCUITO IMPRESO.
摘要 <p>A contact receptacle for substrate to circuit board connection comprises a receptacle for an edge of the substrate and a post for insertion in a board aperture integrally joined by an intermediate section comprising a resilient portion [34,] adapted to allow relative movement between the receptacle [32] and post [36] and extensions [40, 56] of the receptacle and the post which overlap in sliding contact to provide a short electrical path between the substrate and the board. The resilient portion may comprise a generally hair-pin spring form [46, 48, 50] having a bight [50] spaced substantially from the post [36]. In an alternative the resilient portion [144] is of reduced width and of sinuous form, with the intermediate section embedded in the elastomer [22].</p>
申请公布号 ES267622(Y) 申请公布日期 1983.12.01
申请号 ES19220002676U 申请日期 1981.05.21
申请人 AMP INCORPORATED 发明人
分类号 H01R13/05;H01R13/405;H01R43/26;H05K1/14;H05K3/30;H05K3/36;H05K7/10;(IPC1-7):05K7/02 主分类号 H01R13/05
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