| 摘要 |
Semiconductor elements are arranged in a semiconductor substrate substantially equidistantly of a dicing line and oriented in the same direction. A region where the semiconductor elements are regularly arranged is the one where, when the semiconductor substrate and a semiconductor element are integrally formed with a sealing member, a characteristic of the semiconductor element abruptly changes, ranging from the center line of the dicing line to a point having stress of 90% of the stress developed in the center area of the semiconductor substrate or ranging from the center line of the dicing line to a point distanced from the center line by a distance 1.8 times the thickness of the semiconductor substrate or less. The semiconductor substrate with semiconductor elements arranged therein is integrally formed by a sealing member. |
