发明名称 |
THICK FILM CONDUCTORS FOR USE IN MICROELECTRONIC PACKAGING AND A METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE |
摘要 |
In a microelectronic package of the type where Si-based integrated circuits are eutectically attached to a Pd/Au-based thick film conductor, a method of reducing the potential for thermal runaway is taught. The method involves increasing the surface area of the Pd to lower the Vbe rating. This reduces the potential for thermal runaway in subsequent integrated circuit operation. It has also been found that increasing the particle size of the Au component further decreases the Vbe rating. |
申请公布号 |
IL60483(A) |
申请公布日期 |
1983.11.30 |
申请号 |
IL19800060483 |
申请日期 |
1980.07.03 |
申请人 |
ELECTRO MATERIALS |
发明人 |
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分类号 |
H01L21/52;H01B1/16;H01L21/48;H01L23/498;H01L27/01;H05K1/09;(IPC1-7):01L23/48;01B1/02;09D5/10 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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