发明名称 SOLDERING APPARATUS
摘要 PURPOSE:To perform automatically soldering without giving any trouble to electric parts and to improve the working property, by installing a through-hole in the support of insulating substrate and a means which moves the substrate to a preheated soldering position through the through-hole. CONSTITUTION:An insulating substrate 26 equipped with terminals 27a and 28a of electric parts 27 and 28 is put in the recessed part 22 of a support 20. The support is placed on rails 4 and a groove 24 at the lower surface of the support 20 is faced to a preheating heater 11 and the soldering part at the lower surface of the substrate 26 is preheated through a through-hole 25 formed in the groove 24. Then, the support 20 is transferred by using a transferring plate 10 and the groove 24 is allowed to correspond to an ejecting hole 17 installed in a solder tub 13. The molten solder 18 ejected from the ejecting hole 17 is controlled by the groove 24 and contacts the terminal 27a (28a) at the lower surface of the substrate 26 through the through-hole 25 formed in the groove 24, and thus, the soldering is performed.
申请公布号 JPS58205674(A) 申请公布日期 1983.11.30
申请号 JP19820088707 申请日期 1982.05.25
申请人 TOUKAI RIKA DENKI SEISAKUSHO:KK 发明人 YANAGI OSAMU;TSUJI TAKEHIRO
分类号 H05K3/34;B23K1/08;B23K3/08 主分类号 H05K3/34
代理机构 代理人
主权项
地址