发明名称 Metallisation production on especially III-V semiconductor body
摘要 A method of producing a semiconductor body having a metallisation layer involves dry etching (5) at least a surface region of the semiconductor body (1) and then applying the metallisation layer (2) onto the surface region. Preferably, the dry etching (5) comprises a plasma etching operation, especially in which the surface is bombarded with Ar ions and in which the surface region is roughened.
申请公布号 DE19637438(A1) 申请公布日期 1998.03.26
申请号 DE19961037438 申请日期 1996.09.13
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 LANG, GISELA, 93057 REGENSBURG, DE;JACOB, ULRICH, DR., 93053 REGENSBURG, DE;MAURER, JOSEF, 93186 PETTENDORF, DE;NIRSCHL, ERNST, DR., 93173 WENZENBACH, DE
分类号 H01L21/285;H01L33/30;H01L33/40;(IPC1-7):H01L21/28;H01L33/00;H01L21/321 主分类号 H01L21/285
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