| 摘要 |
PURPOSE:To perform automatically soldering to an insulating substrate without giving any trouble to electric parts and improve the working property, by installing a means which supports the insulating substrate in correspondence to the ejecting hole of a solder tub and faces a support having a through-hole to the ejecting hole. CONSTITUTION:An ejection cover 16 is put on the opening 14 of an ejection cylinder 15 installed erectly in a solder tub 13 and an ejecting hole part 17 is projected from the upper surface of the cover 16. On the other hand, a groove 24 is formed in the lower surface of a support 20 made of a heat resistive material and a through-hole 25 is pierced through the rear wall 24a of the groove 24. An insulating substrate fitted with terminals 27a and 28a of electric parts 27 and 28 is put in the recessed part 22 of the support 20. Then, the support 20 is placed on rails 4 and moved to a soldering location and the groove 24 of the support 20 is allowed to correspond to the ejecting hole 17 of the solder tub 13. The molten solder 18 ejected from the hole 17 is controlled by the groove 24 and contacts the terminal 27a (28a) at the lower surface of the substrate 26 through the through-hole 25, and thus, soldering is performed. |
