摘要 |
PURPOSE:To prevent sticking of a flash to a frame which obstructs a soldering process, etc., by providing each pair of the push plates which hold the frame and of the leaf springs which press the push plates at the upper and lower sides in a resin sealing mold. CONSTITUTION:A frame 1 is set in the groove 8 of a mold 2 so as to protrude its part into a molding room 7, one pair of push plates 11 are retreated by closing the mold 2 and one pair of corresponding leaf springs 12 are bent via one pair of retreating push plates 11. The frame is held by pressing one pair of corresponding push plates 11 with the elastic force of the leaf springs. Because one pair of push plates 11 correspond to several molding rooms 7 corresponding to an individual molding room 7, there is no clearance between a pair of push plates 11 and the frame 1. Then, a thermoset resin is put in from an opening part, poured into the molding room 7 via a passage 6 and the resin is pressed, heated and hardened. |